Hot Melt Apparatus and Method of Use

ABSTRACT

In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material&#39;s melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material&#39;s melting temperature while remaining connected to the structural body.

RELATION

This application claims priority through U.S. Provisional Application62/533,608, filed Jul. 17, 2017.

BACKGROUND OF THE INVENTION

A hot melt device comprising a heating device that is automatically ormanually triggered to heat a pre-formed thermoplastic feedstock isrecognized as an existing technology. Applications using such devicesallow connection of objects to provide mechanical and/or electricalbonding and incorporate flexibility, repeatability and reusability ofthe connections.

A hot melt apparatus typically includes a structural body, a heatingelement of various designs, and an automatic or manual control system tomelt thermoplastic materials. In operation, mechanical extrusion of aheated thermoplastic material onto a surface to be joined as thethermoplastic material cools and solidifies is used.

FIGURES

Various figures are included herein which illustrate aspects ofembodiments of the disclosed inventions.

FIG. 1 is a block diagrammatic view in partial perspective of a firstexemplary system;

FIG. 2 is an illustration of various shapes adapted to improve a bond ofthermoplastic material 2 with a the contacted surface;

FIG. 3 is a block diagrammatic view in partial perspective of a secondexemplary system where one or more interchangeable interfaces 5 aredisposed intermediate structural body 3 and heater 4 and comprises upperportion 5 a connected to structural body 3 and lower portion 5 bconnected to heater 4, where upper portion 5 a and lower portion 5 n areselectively disconnectable from each other;

FIG. 4 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating a separable interface;

FIG. 5 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating a mechanical integrator;

FIG. 6 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating an electrical integrator;

FIG. 7 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating a mechanical integrator;

FIG. 8 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating a mechanical integrator and an electricalintegrator;

FIG. 9 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating use of a cable manager;

FIG. 10 is a block diagrammatic view in partial perspective of a furtherexemplary system illustrating an electrical integrator and variouselectrical ground paths;

FIG. 11 is a block diagrammatic view in partial perspective of a furtherexemplary system;

FIG. 12 is a block diagrammatic view in partial perspective of anexemplary system;

FIG. 13 is a block diagrammatic view in partial perspective of a furtherexemplary system integrated within a common structural body 3 withthermoplastic material 2 at both ends to create a double sided hot meltapparatus 15; and

FIG. 14 is a view in partial perspective of an exemplary systemillustrating that system in use.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Referring now to FIG. 1, in a first embodiment hot melt apparatus 1comprises structural body 3; thermoplastic material 2, in a solid form,connected to structural body 3, where the solid form thermoplasticmaterial 2 is mechanically extrudable onto a surface to be joined as theheated solid form thermoplastic material 2 cools and solidifies; andcontrollable heater 4 connected to the structural body and to the solidform thermoplastic material 2, heater 4 controllable to heat the solidform thermoplastic material 2 to a temperature above its meltingtemperature and to allow the heated solid form thermoplastic material 2to cool and solidify without the use of a solvent.

Referring additionally to FIG. 2, solid form thermoplastic material 2may comprise a shaped thermoplastic material 2, where the shape isadapted to improve a bond of thermoplastic material 2 with a thecontacted surface. By way of example and not limitation, the shape maycomprises a geometric profile and/or pattern and may further comprisevarying thicknesses when melted wherein the connection of rough oruneven surfaces are completed.

Heater 4 may be an electro-chemical heater activated using a low powerelectrical signal. In other embodiments, heater 4 may be chemical basedand activated through mixing of various chemicals.

Referring additionally to FIG. 3, in embodiments hot melt apparatus 1may further comprise one or more interchangeable interfaces 5 disposedintermediate structural body 3 and heater 4. Interchangeable interface 5may comprises upper portion 5 a connected to structural body 3 and lowerportion 5 b connected to heater 4, where upper portion 5 a and lowerportion 5 n are selectively disconnectable from each other. In some ofthese embodiments, heater 4 and thermoplastic material 2 are integraland may be integrated to, but remain separable from, structural body 3.

Referring additionally to FIG. 4, in embodiments separable interface 6is present and disposed intermediate heater 4 and thermoplastic material2. Typically, separable interface 6 is adapted to create an evenlydistributed thermal transfer of heat into thermoplastic material 2.Separable interface 6 comprises a metal, a plastic, a ceramic, or acomposite, or the like, or a combination thereof.

In certain of these embodiments, separable interface 6 comprises upperportion 6 a connected to heater 4 and lower portion 6 b selectivelydetachable from upper portion 6 a, where lower portion 6 b issubstantially permanently attached to thermoplastic material 2.

In embodiments separable interface 6 further comprises a thermallyconductive material and a heating element operative to meltthermoplastic material by transferring heat to the hot melt pad.

In other embodiments, separable interface 6 comprises an electricallyconductive material and the hot melt pad comprises a heater. For some ofthese embodiments, separable interface 6 further comprises anelectrically conductive separable interface configured to provide agrounding path through the hot melt apparatus.

Referring additionally to FIGS. 5 and 7, in further embodiments hot meltapparatus 1 comprises mechanical integrator 7 which is configured toallow hot melt apparatus 1 to be mechanically integrated to object 8such as to become a tool or structural extension of object 8.

Referring additionally to FIGS. 6 and 10 in further embodiments hot meltapparatus 1 comprises electrical integrator 9 which is configured toallow hot melt apparatus 1 to be electrically integrated to object 8.Electrical integrator 9 provides a power and/or a ground path wherepower, and/or a ground, may be obtained from object 8 to support theoperation of hot melt apparatus 1. Electrically conductive cable 13 mayalso be present in such embodiments and operatively in communicationwith electrical integrator 9 at a first end and with object 8 at asecond end. Electrically conductive cable 13 may be used to implement anelectrical ground path between object 8 and secondary object 14 (FIG.10).

Referring additionally to FIG. 11, in embodiments comprising a pair ofhot melt apparatuses 1, electrical integrators 9 of the pair of hot meltapparatuses 1 may be operatively connected by electrically conductivecable 13 which may further be operative to create an electrical groundpath when the pair of hot melt apparatuses 1 are bonded separately toobject 8 and secondary object 14.

In other embodiments where there is a plurality of hot melt apparatuses1, the plurality of hot melt apparatuses 1 may be connected bymechanical integrators 7 and electrical integrators 9 and one or more ofthe plurality of hot melt apparatuses 1 used to bond object 8 tosecondary object 14. These multiple hot melt apparatus 1 may beintegrated in a number equal to the number of objects 8,14 to be joined.The plurality of paired hot melt apparatuses may be equal in number to anumber of objects 8 to be joined.

Referring additionally to FIG. 13, the plurality of hot melt apparatus1, which may be a pair, may further be integrated within a commonstructural body 3 with thermoplastic material 2 at both ends to create adouble sided hot melt apparatus 15 which may be used to bond object 8 tosecondary object 14. Double sided hot melt apparatus 15 may achieve anelectrical ground path between object 8 and secondary object 14.

Referring additionally to FIG. 9, for embodiments with cables, cablemanager 11 may be present and operatively connected to hot meltapparatus 1, where cable manager 11 is configured to providepositioning, placement and retention of cables, ropes, or tethers. Incertain embodiments, cable manager 11 comprises a hook shape.

Still referring to FIG. 9, in one or more embodiments hot melt apparatus1 further comprises material manager 12 operatively connected to hotmelt apparatus 1. Material manager 12 may comprise a plow or similarshape to aid in providing for the movement, lifting, and retention ofmoveable surface materials of object 8.

In most of these embodiments, thermoplastic material 2 may comprise anelectrically conductive material which may further provide a groundingpath through thermoplastic material 2.

In the operation of exemplary embodiments, referring generally to FIG.14, a thermoplastic material may be applied to a surface using hot meltapparatus 1 as described above in its various embodiments, where thevarious embodiments and their application methods illustrate a departurefrom the current art.

Thermoplastic material 2 is brought in its solid form into contact witha surface via mechanical extrusion of thermoplastic material 2 andheater 4 used to heat thermoplastic material 2 to a temperature at orabove a melting temperature of thermoplastic material 2 whilemaintaining the contact of thermoplastic material 2 with the surface.Thermoplastic material 2 may be electrically conductive and providing agrounding path through the electrically conductive thermoplasticmaterial 2.

Once applied, as illustrated in FIG. 2, heated thermoplastic material 2is allowed to cool to a temperature that is below thermoplasticmaterial's 2 melting temperature and the heated thermoplastic material 2allowed to bond hot melt apparatus 1 to the contacted surface 14 withouta solvent or use of a curing chemical reaction when the heatedthermoplastic material 2 is cooled to below the melting temperature ofthermoplastic material 2.

Thermoplastic material 2 in solid form may further comprise apredetermined shape selected to comprise as shape that improves the bondof thermoplastic material 2 with the contacted surface. The shapetypically comprises a predetermined geometric pattern. Where the surfacecomprises a rough or uneven surface, the method may further comprisevarying a thickness of the selected shape of thermoplastic material 2wherein the connection of rough or uneven surfaces are completed.

If present, as illustrated in FIG. 4, separable interface 6 may bedisposed intermediate heater 4 and thermoplastic material 2, whereseparable interface 6 comprises upper portion 6 a connected to heater 4and lower portion 6 b selectively attachable and detachable from upperportion 6 a which is substantially permanently attached to thermoplasticmaterial 2. In such embodiments, separable interface 6 may be used tocreate an evenly distributed thermal transfer of heat into thermoplasticmaterial 2.

In embodiments comprising mechanical integrator 7 and referringgenerally to FIG. 5, hot melt apparatus 1 may be mechanically integratedonto and/or in to object 8 using mechanical integrator 7 to become atool or structural extension of object 8.

In other embodiments, hot melt apparatus 1 may be temporarily attachedto placement device 10 using mechanical integrator 7 and subsequentlydisconnected from placement device 10 after a bond comprisingthermoplastic material 2 is created to object 8.

In embodiments where hot melt apparatus 1 further comprises electricalintegrator 9, and as generally illustrated in FIG. 8, hot melt apparatus1 may be electrically integrated with object 8 using electricalintegrator 9 and one or more electrical pathways provided from object 8to support the operation of hot melt apparatus 1. This may includetemporarily attaching hot melt apparatus 1 to placement device 10 usingelectrical integrator 9 disconnecting placement device 10 from hot meltapparatus 1 after a bond comprising thermoplastic material 2 is createdto object 8.

In embodiments comprising a plurality of hot melt apparatuses 1, and asgenerally illustrated in FIG. 11, one or more electrically conductivecables 13 may be used to operatively interconnect electrical integrator9 of a first hot melt apparatus 1 of the plurality of hot meltapparatuses 1 to electrical integrator 9 a second hot melt apparatus 1of the plurality of hot melt apparatuses 1. Additionally, one or moreelectrical ground paths may be created through electrically conductivecable 13 when one or more of the plurality of hot melt apparatuses 1 arebonded separately to object 8 and, optionally, secondary object 14. Inother of these embodiments, two or more of the plurality of hot meltapparatuses 1 may be interconnected by mechanical integrators 7 andelectrical integrators 9 and used to bond object 8 to secondary object1.

In other contemplated embodiments, and as generally illustrated in FIGS.13 and 14, two or more hot melt apparatus 1 may be integrated within acommon structural body 3 with thermoplastic material 2 at both ends tocreate a double-sided hot melt apparatus 15. The double-sided hot meltapparatus 15 may be used to bond object 8 to secondary object 14.

Where heater 4 comprises an electro-chemical heater, heater 4 may beactivated using a low power electrical signal.

Where heater 4 comprises a chemical based heater, heater 4 may beactivated through mixing of chemicals in heater 4.

In most of the contemplated embodiments, cooled thermoplastic material 2may be reheated to allow removal of hot melt apparatus 1 from surface towhich the thermoplastic material 2 has been bonded. In theseembodiments, multiple heating and cooling cycles of hot melt apparatus 1may be allowed, further allowing use and reuse of hot melt apparatus 1multiple times.

The foregoing disclosure and description of the inventions areillustrative and explanatory. Various changes in the size, shape, andmaterials, as well as in the details of the illustrative constructionand/or an illustrative method may be made without departing from thespirit of the invention.

What is claimed is:
 1. A hot melt apparatus, comprising: a. a structuralbody; b. a solid form thermoplastic material connected to the structuralbody, the solid form thermoplastic material mechanically extrudable ontoa surface to be joined as the heated solid form thermoplastic materialcools and solidifies while remaining connected to the structural body;and c. a controllable heater connected to the structural body and to thesolid form thermoplastic material, the controllable heater comprising aheat generator able to heat the solid form thermoplastic material to atemperature above its melting temperature and able to cool to atemperature which allows the heated solid form thermoplastic material tocool and solidify without the use of a solvent.
 2. The hot meltapparatus of claim 1, wherein the solid form thermoplastic materialfurther comprises a shape adapted to improve a bond of the thermoplasticmaterial joined with the surface.
 3. The hot melt apparatus of claim 2,wherein the shape comprises a geometric profile comprising a varyingthickness of melted thermoplastic material.
 4. The hot melt apparatus ofclaim 1, further comprising an interchangeable interface disposedintermediate the structural body and the heater.
 5. The hot meltapparatus of claim 4, wherein: a. the interchangeable interfacecomprises an upper portion connected to the structural body and a lowerportion connected to the heating mechanism and to the upper portion, theupper portion and the lower portion being selectively disconnectablefrom each other; and b. the heater and the thermoplastic material areintegral and are selectively disconnectable to the apparatus structuralbody.
 6. The apparatus of claim 1, further comprising a separableinterface disposed intermediate the heater and the thermoplasticmaterial, the separable interface comprising an upper portion connectedto the heating mechanism and a lower portion selectively attachable fromthe upper portion, the lower portion permanently attached to thethermoplastic material.
 7. The apparatus of claim 6, wherein theseparable interface is adapted to create an evenly distributed thermaltransfer of heat into the thermoplastic material.
 8. The apparatus ofclaim 6, wherein the separable interface comprises a thermallyconductive material, a thermally non-conductive material, anelectrically conductive material, or an electrically non-conductivematerial.
 9. The apparatus of claim 6, wherein the separable interfacecomprises a metal, a plastic, or a ceramic.
 10. The apparatus of claim1, further comprising a mechanical integrator, configured to allow thehot melt apparatus to be mechanically integrated to an object to becomea tool or structural extension of the object.
 11. The apparatus of claim1, further comprising an electrical integrator configured to allow thehot melt apparatus to be electrically integrated to an object andprovide an electrical pathway to be established with the object tosupport the operation of the hot melt apparatus.
 12. The apparatus ofclaim 11, further comprising an electrically conductive cableoperatively in communication with the electrical integrator of the hotmelt apparatus at a first end and with the object at a second other end,the electrically conductive cable operative to create an electricalground path between the object and a secondary object.
 13. The apparatusof claim 12 further comprising a pair of the hot melt apparatuses whoseelectrical integrators are operatively interconnected by an electricallyconductive cable, the electrically conductive cable operative to createan electrical ground path when the pair of hot melt apparatuses arebonded separately to the object and the secondary object.
 14. The hotmelt apparatus of claim 1, further comprising a cable manageroperatively connected to the hot melt apparatus, the cable managerconfigured to provide positioning, placement and retention of cables,ropes, or tethers.
 15. The hot melt apparatus of claim 14, wherein thecable manager comprises a hook shape.
 16. The hot melt apparatus ofclaim 1, further comprising a material manager operatively connected tothe hot melt apparatus,
 17. The hot melt apparatus of claim 16, whereinthe material manager comprises a plow shape configured to aid inproviding for movement, lifting, and retention of moveable surfacematerials of the object.
 18. The apparatus of claim 2 wherein thethermoplastic material comprises an electrically conductive materialable to provide a grounding path through the thermoplastic material. 19.The apparatus of claim 1 wherein the controllable heater comprises anelectro-chemical heater activated using a low power electrical signal.20. The apparatus of claim 1 wherein the controllable heater comprisinga chemical based heater activated through mixing of chemicals.
 21. Adouble sided hot melt apparatus, comprising: a. a shared structural bodycomprising a first end and second end; and b. a pair of hot meltapparatuses, each hot melt apparatus comprising: i. a solid formthermoplastic material connected to and disposed at the first end andthe second end of the shared structural body, the solid formthermoplastic material mechanically extrudable onto a surface of anobject to be joined as the heated solid form thermoplastic materialcools and solidifies while remaining connected to the structural body;and ii. a controllable heater connected to the shared structural bodyand to the solid form thermoplastic material, the controllable heatercomprising a heat generator able to heat the solid form thermoplasticmaterial to a temperature above its melting temperature and able to coolto a temperature which allows the heated solid form thermoplasticmaterial to cool and solidify without the use of a solvent.
 22. Thedouble sided hot melt apparatus of claim 21, wherein the double sidedhot melt apparatus creates an electrical ground path between the objectan a secondary object when joined to the object.
 23. A system of doublesided hot melt apparatuses, comprising: a. a plurality of double sidedhot melt apparatuses, each double sided hot melt apparatus comprising:i. a shared structural body comprising a first end and second end; andii. a pair of hot melt apparatuses, each hot melt apparatuscomprising:
 1. a solid form thermoplastic material connected to anddisposed at the first end and the second end of the shared structuralbody, the solid form thermoplastic material mechanically extrudable ontoa surface of an object to be joined as the heated solid formthermoplastic material cools and solidifies while remaining connected tothe structural body; and
 2. a controllable heater connected to theshared structural body and to the solid form thermoplastic material, thecontrollable heater comprising a heat generator able to heat the solidform thermoplastic material to a temperature above its meltingtemperature and able to cool to a temperature which allows the heatedsolid form thermoplastic material to cool and solidify without the useof a solvent; and b. an integrator 7,9 connected to the sharedstructural body and adapted to connect the double sided hot meltapparatuses to a further structure.
 24. The apparatus of claim 23,wherein the integrator 7,9 comprises a mechanical integrator 7 or anelectrical integrator
 9. 25. The apparatus of claim 23, wherein thenumber of the plurality of hot melt apparatuses corresponds to a numberof objects to be joined.
 26. A method of applying a thermoplasticmaterial to a surface using a hot melt apparatus comprising a structuralbody, a selectively controllable heater connected to the structuralbody, and a solid form thermoplastic material operatively connected tothe structural body and the heater, the method comprising: a. bringingthe thermoplastic material in its solid form into contact with a surfacevia mechanical extrusion; b. using the heater to heat the thermoplasticmaterial to a temperature above a melting temperature of thethermoplastic material while maintaining the contact of thethermoplastic material with the surface; c. allowing the heatedthermoplastic material to cool to a temperature that is below thethermoplastic material's melting temperature; and d. allowing the heatedthermoplastic material to bond the hot melt apparatus to the contactedsurface without a solvent or use of a curing chemical reaction when theheated thermoplastic material is cooled to below the thermoplasticmaterial's melting temperature while remaining connected to thestructural body.
 27. The method of applying a thermoplastic material toa surface using a hot melt apparatus of claim 26, wherein thethermoplastic material in solid form further comprises a predeterminedshape, the method further comprising selecting the predetermined shapeas shape a that improves the bond of the thermoplastic material with thecontacted surface, the shape comprising a geometric profile when theconnection of complex surfaces are completed.
 28. The method of applyinga thermoplastic material to a surface using a hot melt apparatus ofclaim 27, wherein the surface comprises a rough or uneven surface, themethod further comprising varying a thickness of the selected shape ofthe thermoplastic material wherein the connection of rough or unevensurfaces are completed.
 29. The method of applying a thermoplasticmaterial to a surface using a hot melt apparatus of claim 26, the hotmelt apparatus further comprising a separable interface disposedintermediate the heater and the thermoplastic material, the separableinterface comprising an upper portion connected to the heating mechanismand a lower portion selectively detachable from the upper portion, thelower portion permanently attached to the thermoplastic material, themethod further comprising using the separable interface to create anevenly distributed thermal transfer of heat into the thermoplasticmaterial.
 30. The method of applying a thermoplastic material to asurface using a hot melt apparatus of claim 26, further comprisingreheating the cooled thermoplastic material to allow removal of the hotmelt apparatus the surface to which the thermoplastic material isbonded.
 31. The method of applying a thermoplastic material to a surfaceusing a hot melt apparatus of claim 30, further comprising allowingmultiple heating and cooling cycles of the hot melt apparatus, whereinthe hot melt apparatus may be reused multiple times.
 32. The method ofapplying a thermoplastic material to a surface using a hot meltapparatus of claim 26, the hot melt apparatus further comprising amechanical integrator, the method further comprising mechanicallyintegrating the hot melt apparatus to any object to become a tool orstructural extension of the object.
 33. The method of applying athermoplastic material to a surface using a hot melt apparatus of claim32, further comprising: a. temporarily attaching the hot melt apparatusto a placement device using the mechanical integrator; and b.disconnecting the placement device from the hot melt apparatus after thethermoplastic material bond is created to a surface.
 34. The method ofapplying a thermoplastic material to a surface using a hot meltapparatus of claim 26, the hot melt apparatus further comprising anelectrical integrator, the method further comprising: a. electricallyintegrating the hot melt apparatus with an object; and b. providing anelectrical pathway from the object to support the operation of the hotmelt apparatus.
 35. The method of applying a thermoplastic material to asurface using a hot melt apparatus of claim 34, further comprising: a.temporary attachment of the hot melt apparatus to any placement deviceusing the electrical integrator; and b. disconnecting the placementdevice from the hot melt device after the thermoplastic material bond iscreated to any object.
 36. The method of applying a thermoplasticmaterial to a surface using a hot melt apparatus of claim 34, furthercomprising using a pair of hot melt apparatuses, the method furthercomprising: a. using an electrically conductive cable to operativelyinterconnect the electrical integrator of a first hot melt apparatus ofthe pair of hot melt apparatus to electrical integrator a second hotmelt apparatus of the pair of hot melt apparatus; and b. creating anelectrical ground path through the electrically conductive cable whenthe hot melt apparatuses are bonded separately to any object and anysecondary object.
 37. The method of applying a thermoplastic material toa surface using a hot melt apparatus of claim 26, wherein the hot meltapparatuses are connected by mechanical integrators and electricalintegrators and used to bond the object to any other secondary object.38. The method of applying a thermoplastic material to a surface using ahot melt apparatus of claim 26, further comprising: a. integrating apair of hot melt apparatus within a common structural body withthermoplastic material at both ends to create a double sided hot meltapparatus; and b. using the double sided hot melt apparatus to bond theobject to any other secondary object.
 39. The method of applying athermoplastic material to a surface using a hot melt apparatus of claim38, further comprising using a plurality of pairs of hot meltapparatuses, the plurality of paired hot melt apparatuses equal innumber to a number of objects to be joined.
 40. The method of applying athermoplastic material to a surface using a hot melt apparatus of claim39, further comprising: a. using a thermoplastic material that iselectrically conductive; and b. providing a grounding path through theelectrically conductive thermoplastic material.
 41. The method ofapplying a thermoplastic material to a surface using a hot meltapparatus of claim 26, the heater comprising an electro-chemical heater,the method further comprising activating the electro-chemical heaterusing a low power electrical signal.
 42. The method of applying athermoplastic material to a surface using a hot melt apparatus of claim26, the heater comprising a chemical based heater, the method furthercomprising activating the chemical based heater through mixing ofchemicals in the chemical based heater.